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Rumors are that less extreme ways are also possible, for instance torch300

Wanted to touch on this.. You can use (add) LOW MELT solder to the pins before running the torch, it will come off way faster with alot less heat. I use low melt solder daily to remove high pin count components, down to SMD connectors, etc.. It requires VERY LOW heat so most of the time you can heat up all solder points and they stay hot enough to remove the part.. Now on something this big you would add the low melt then use the torch/hot air station back and fourth over the pins till they reach the low melt temp and it would just fall out basically

But I guess if we dont care about donor board then it don't matter much, but this is just a cleaner, less Melt everything type of way